Onsen Inc. is proud to be the exclusive distributor of Yantai Darbond Technology Co., Ltd. (Darbond Technology) in Southeast Asia and North America. Darbond Technology is a national-level enterprise specializing in the R&D and industrialization of advanced electronic packaging materials. With strong technical expertise and a comprehensive product portfolio, Darbond has earned a leading reputation in the global electronic materials industry.
Darbond’s core product offerings cover integrated circuit packaging materials, smart terminal packaging materials, new energy application materials, and high-end equipment application materials. These solutions are widely applied in wafer processing, chip-level packaging, power device packaging, module assembly, and system integration. They are designed to meet multiple functional requirements including structural bonding, thermal management, electrical conductivity, insulation, and electromagnetic shielding, supporting customers across all packaging levels from Level 0 to Level 3.
With a product line of over 400 items, Darbond’s key series include thermal pads, thermal insulation materials, chip-level thermal interface materials, thermal greases, thermal gels, adhesives, phase change materials, absorptive materials, and EMI conductive adhesives. These products are widely used in industries such as automotive electronics, data & telecom, consumer & industrial electronics, medical, solar energy, and aerospace, helping customers enhance product performance and reliability across diverse applications.
As the regional distributor of Darbond Technology, Onsen Inc. not only delivers products but also provides professional technical services and localized support. We are committed to offering fast response and expert guidance to help our partners choose the most suitable material solutions, driving the electronics industry toward higher performance and sustainable growth.
